Veeco Instruments Inc. is stepping up its game in the annealing sector by broadening its Served Available Market (SAM), capitalizing on the rising demand for High Bandwidth Memory (HBM) and advanced packaging solutions. In February 2025, the company shipped its NSA500™ Nanosecond Annealing system to a leading semiconductor company for producing 2-nanometer gate-all-around logic chips, a key technological step for advanced node and 3D applications. This system is tailored for low thermal budget applications such as Backside Power Delivery and Contact Annealing.
In support of these developments, Veeco is also conducting evaluation programs with two additional major customers for the NSA500 system, with several potential clients demonstrating strong interest, as reported by the company’s investor relations page. This indicates a substantial demand in the market. Moreover, in November 2024, Veeco announced over $50 million in orders for its WaferStorm® system, aimed at supporting advanced packaging for AI applications, driven by leading foundries and HBM manufacturers.
Veeco's increased focus on advanced logic and memory has helped outpace wafer fabrication equipment growth for the past three years, notes a recent report on Fintel. Veeco continues to invest in new technologies, aiming to broaden its application range, particularly in the growing HBM and advanced packaging sectors. These initiatives highlight Veeco's commitment to advancing semiconductor technologies in response to evolving industry needs.